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Ceramic Substrate Singulation We offer innovative solutions for singulating and assembling ceramic substrates with the baumann break|box. Applications: The patented baumann break|box singulates laser scribed and scored DBC, LTCC, Thick Film Hybrids, HTCC type ceramic panels etc. Performance: The baumann break|box singulates substrates down to a minimum size of 5 x 5 mm with panel sizes of 4“ x 4“ up to 9“ x 8“ and a substrate thickness between 0.25 and 1 mm, while the minimum distance of the substrate to scoring or laser scribing is between 0.2 and 0.5 mm. The cycle time for a single substrate is between 3.5 and 5 seconds. Features: The handling and singulation is unique. Supplied panels are positioned by a robot and separated without fixations or mechnical stops, while high reject costs, conchoidal fractures and special type-related systems belong to history. Another highlight is the easy to use configuration of new panel types. Within minutes a new panel type is stored with its design parameters in the software library and can directly be used for a type exchange without any mechanical retrofitting. Options: The baumann break|box is available as a standalone- or inline-cell. A variety of options simplifies the integration in assembly lines. Contact us for further information about our tailor-made solutions for singulating ceramic substrates: This e-mail address is being protected from spambots. You need JavaScript enabled to view it Info download: baumann_ceramic_substrate_singulation_pdf
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